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MCM72FB8ML7.5R PDF资料和参数原理简介

品牌 : Motorola 

封装形式 : PBGA 

引脚数量 : 209 

温度范围 : 最小 0 °C | 最大 70 °C

文件大小 : 277 KB

功能应用 : 256K and 72 bit burstRAM multichip module 

MCM72FB8ML7.5R PDF资料下载