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UT8R256K1615TBDCC是什么作用： 256K x 16 SRAM. 15ns access time. Lead finish gold.
UT8R256K1615TBDCC类似电子元器件：
- UT8R128K32-15WCA
- 128K x 32 SRAM. 15ns access time. Lead finish hot solder dipped.
- UT8R128K32-15WCC
- 128K x 32 SRAM. 15ns access time. Lead finish gold.
- UT8R128K32-15WCC
- 128K x 32 SRAM. 15ns access time. Lead finish gold.
- UT8R128K32-15WCC
- 128K x 32 SRAM. 15ns access time. Lead finish gold.
- UT8R128K32-15WPC
- 128K x 32 SRAM. 15ns access time. Lead finish gold. Prototype flow.
- UT8R128K32-15WPC
- 128K x 32 SRAM. 15ns access time. Lead finish gold. Prototype flow.
- UT8R128K32-15WPC
- 128K x 32 SRAM. 15ns access time. Lead finish gold. Prototype flow.
- UT8R128K32-15WWC
- 128K x 32 SRAM. 15ns access time. Lead finish gold.
UT8R256K1615TBDCC PDF资料和参数原理简介
品牌 : UTMC
封装形式 : TBD
引脚数量 : 48
温度范围 : 最小 -55 °C | 最大 125 °C
文件大小 : 103 KB
功能应用 : 256K x 16 SRAM. 15ns access time. Lead finish gold.
UT8R256K1615TBDCC PDF资料下载